External Visual Inspection

High magnification microscope observation will determine whether the IC is qualified by the appearance of the component, such as: package form, package material, IC pin, surface Marking, component size, etc., to determine whether the physical characteristics of the component meet the standards.

X-Ray

Using X-ray fluoroscopy components. Checking bonding for abnormalities, packaging for defects, confirming die size and layout.

Function Testing

Simulate the real working state of the device, connect the hardware circuit, set the parameter vector, and perform the parameter analysis.

Decapsulation

Using the instrument to erode the package on the surface of the chip, check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, the wafer code, can determine the authenticity of the chip.

Soderability Test

Ability to detect reliable soldering of pins to PCB

Tape and reel

Additional services. We can roll up the parts to make the equipment easy to put on the machine if the customer wants.